J-STD – 001E PDF
IPC J-STDE, Requirements for Soldered Electrical and Electronic Assemblies released, updated for all three classes of construction. Requirements for. Soldered Electrical and Electronic. Assemblies. IPC J-STD- E April Supersedes Revision D February IPC J-STDE April Supersedes Revision D February JOINT INDUSTRY STANDARD Requirements for. Soldered Electrical and Electronic.
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Resistance between the tip of soldering systems and the workstation common point ground should not exceed 5 ohms Heated element and tips are measured when at their normal operating temperature Note: If your company buys lPC standards and public. Any solder buildup jstd the outside of the cup shall not [D1D2D3] affect formfit or fun ction d. The solder fi ll et on the lead termination side is wetted of the PTH barrel and 0 of the lead d.
End joint width 6. A c urvature shall [DID2D3] be incl uded in the unwrapped wire portion of the jumper to provide re lief of L e nsion from envi ro nmental loading. The top of the lead should not extend beyond the top of the component body, except for preformed stress loops e.
Such mechanical securing should prevent movement between the parts of the connection during the k-std ng operatio n. Notes 1, 2 Voids Required underfill or staking material is present and completely cured. Meltable sealing rin g does not interfere with formation of u-std uired solder connection i. Once parts are mounted on printed boards, the unsoldered assembly shall  be handledtranspOJ1ed e.
The capability to preheat printed wiring assemblies b. The maximum space betwecn lhe component body and lhe board shall [N IN2I’3] not exceed 0. The orientation of the clinch relative to any conductor is optional. The thermal transfer plane acceptance criteria are design and process related. Radial s plit 3 max 2.
J-STDE: Requirements for Soldered Electrical and Electronic Assemblies
Plane Void Criteria Note 6 Note1: Solder does not louch componenl body. S wrapped more Ihan and remains in conlacl w? The material shall [D I] be cured 3. If usedco ntrolled accelerated or slo wed ramp cooling shall [NI] be in accordance with documented procedures.
J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies
Alignment Solder 1SpacingFigure Solder ball offset c does not violate minimum electrical clearance. End joint widlh 2. Unspecified parameler or variable in size as delermined by design Note 3: T he thermal transfer plane acceptance j-td teria are design and process related.
A wire that is wrapped more than 00e1 crosses over itselti. Measurement is made from the end of the part. Rework is covered in Users who wish to incorporate additional criteria for measle conditions may consider incorporating the provisions of IPCl2Class 3A which does not allow measles for Class 3 product Note: Exposed basis metal shall not [D ID2D3] prevent the formation of an solder conn ecti on b.
Not bridge between the substrale and the bottom of radial leaded components. Before acceptance criteria can be devel oped there needs to be significant use so that a history of failure data can be captured from mu ltiple users. Marks or scratchese.
The likelihood of criteria not aligning increases when different revisions are used together. The intent of this document is to rely on process control methodology to ensure consistent qu a1 ity levels during the manufacture of products.
Weight is expressed in grams 1. No service loop 5.
Wetting is evident Note 4: Solder fillel may exlend through the top bend. For operator comfort and solderabil? All leads shall  have stress relief when the component is clipped or adhesive mounted or otherwise constrained. Does nol violale minimum eleclrical clearance Note 2: For intrusive soldering there may not be an exlernal fiUel be tN een J-dtd lead and the land Note 2: